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Bonding Wire
Palladium-Plated Copper Wire
A high-performance semiconductor packaging material that combines the reliability of gold wire with the cost-effectiveness of copper wire.
Bonding Copper Wire
A high-performance, cost-effective semiconductor packaging solution offering superior conductivity and mechanical stability.
Gold-Plated Palladium-Copper Wire
Gold-wire reliability with copper-core economy: anti-oxidation and high-bonding stability.
Palladium-Plated Copper Wire
Palladium-Plated Copper Wire
Feature One
Superior Oxidation Resistance
Feature Two
Gold-Like Reliability
Feature Three
High Cost-Effectiveness
Feature Four
Excellent Bonding Strength
Feature Five
Widened Process Window
Feature Six
Optimized for Fine-Pitch Packaging
Bonding Copper Wire
Bonding Copper Wire
Feature One
Exceptional Cost Efficiency
Feature Two
Superior Electrical Conductivity
Feature Three
Outstanding Thermal Dissipation
Feature Four
High Mechanical Strength
Feature Five
Advanced Intermetallic Stability
Feature Six
Mature High-Volume Solution
Gold-Plated Palladium-Copper Wire
Gold-Plated Palladium-Copper Wire
Feature One
Ultimate Oxidation Resistance
Feature Two
Gold-Wire Equivalent Reliability
Feature Three
Superior Stitch Bonding Window
Feature Four
Balanced Hardness for Pad Protection
Feature Five
Enhanced Corrosion Resistance
Feature Six
High-Density & Fine-Pitch Ready
Jinan Zunbo CNC Technology Co., Ltd.
The company has successfully obtained various domestic and international quality system certifications—including ISO9001, ISO14001, and IATF16949—and has passed all relevant product testing standards.